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Odisha secures India’s first 3D glass substrate semiconductor facility in Bhubaneswar. Backed by HIPSPL and global giants like Intel, the ₹1,943.53 Cr project targets…
Siegwerk, one of the leading global providers of printing inks and coatings for packaging applications…
Generative AI is set to reshape the $1.2 trillion global packaging market, driving faster product…
Flexible packaging and solutions maker UFlex Ltd will invest over Rs 700 crore to expand…
Vinsak Group, a leading provider of printing and packaging technologies, today announced a strategic realignment…
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