Located in Sanand, the plant will package advanced DRAM and NAND semiconductor wafers supplied from Micron’s global manufacturing network into finished memory and storage productsPrime Minister Narendra Modi will on Saturday inaugurate US memory chipmaker Micron Technology’s assembly, test and packaging (ATMP) facility in Sanand,…
Global leader in connected packaging, Appetite Creative, in partnership with Koenig & Bauer AURAVEO, today released results from its fifth…
Latest Esko and Scantrust software integration further simplifies addition of variable data to packaging artwork sko and Scantrust have announced…
India’s recently introduced Goods and Services Tax (GST) reform strategy has raised eyebrows, and started debates. It has also improved…
PAMEX 2026 success: Leading companies such as Canpac Trends and Akar Limited reinvest in Rapida technology Measurable efficiency gains: Rapida…
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable,…
Extended Producer Responsibility (EPR), which came into effect in October 2025, is…
Reflex Group exhibited at Packaging Innovations at the NEC Birmingham on 11–12…
Digidelta’s BIOND range of bio-based printable films has secured independent ‘OK biobased’…
Latest Esko and Scantrust software integration further simplifies addition of variable data to packaging artwork sko and Scantrust have announced…
As a global leader in dispensing systems, we are addressing the growing need for differentiation in the personal care mass market with accessible premiumization options for…
