Odisha secures India’s first 3D glass substrate semiconductor facility in Bhubaneswar. Backed by HIPSPL and global giants like Intel, the ₹1,943.53 Cr project targets AI and 5G sectors with a 50-million-unit annual capacity. Discover the economic impact and roadmap for this ATMP milestone.Odisha has officially…
Fosber is pleased to announce that Brookfield’s private equity business has completed its acquisition of the company. The transaction, a…
Why Europe’s carton industry is strategically indispensable for brands, retail and Europe Europe is intensively debating climate protection, the circular…
The combined business will be the largest player in the Indian flexible packaging market with over 20 percent market share.…
Cosmo Films, a global leader in specialty films, has been honoured with three SIES SOP Star Awards 2026 in their…
Flint Group, a global leader in inks, coatings, digital printing equipment, and service solutions for packaging, announces its rebrand to…
UPM Specialty Materials and Royal Vaassen introduce an ultra-high barrier paper packaging solution suitable for pet food treats and snacks. As the EU Packaging…
Flexible packaging specialist Parkside has supported artisan crisp maker Two Farmers in…
The PaperX FibreTop Tube from the Neopac Group has been certified as…
SIG announced today that it has been formally recognized by the Association…
DuPont™ Cyrel® Flexographic Solutions, one of the world’s leading flexographic platemaking systems providers, today announced it has opened its state-of…
Mex, Switzerland—Royal Geostick Group, one of Europe’s leading label converters, has purchased a new BOBST MASTER M5 flexo press, purpose-built for the high-volume multilayer label production…
