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Odisha secures India’s first 3D glass substrate semiconductor facility in Bhubaneswar. Backed by HIPSPL and global giants like Intel, the ₹1,943.53 Cr project targets…
Conference Agra Kalka Engineering Works, a trusted name in corrugation machinery solutions, announced the launch…
DS Smith, an International Paper company and leading provider of sustainable and fibre-based packaging solutions,…
The Offset Printers Association (OPA) proudly announced the 7th Edition of Print Olympiad 2026, India’s…
Driven by e-commerce, FMCG and quick commerce, the demand for high quality packaged has been…
WSCS India, already identified as one of the top-most worldwide players in the paper packing…
The elections for the Governing Council Members of the Indian Printing Packaging & Allied Machinery…
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