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Odisha secures India’s first 3D glass substrate semiconductor facility in Bhubaneswar. Backed by HIPSPL and global giants like Intel, the ₹1,943.53 Cr project targets…
Fosber is pleased to announce that Brookfield’s private equity business…
Why Europe’s carton industry is strategically indispensable for brands, retail…
The Indian Paper Corrugated & Packaging Machinery Manufacturers Association (ICPMA), in collaboration with Futurex Group,…
The 12th edition of IndiaCorr 2025, the biggest event for the corrugated packaging industry in India,…
HEIDELBERG and Solenis presented a jointly developed innovative process for barrier coatings on flexible paper…
To meet the packaging industry’s ever-increasing requirements in terms of quality, efficiency and sustainability, Gundlach…
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