(Yavne, Israel) Highcon Systems Ltd, today announced that DS Smith, one of the largest paperboard packaging companies in the world, will be the first company in the world to install the groundbreaking Highcon Beam 3 digital die cutting system. This announcement was made following the Drupa 2024 trade fair, held in D\u00fcsseldorf, Germany, where the Highcon Beam 3 premiered for the first time.<\/p>\n\n\n\n
“DS Smith is glad to start a new partnership with Highcon; innovation is in DS Smith’s DNA\u201d said Armand Chaigne, Managing Director – France & Spain Consumer, DS Smith Packaging Division. \u201cThe implementation of the laser-cut machine Beam 3 in one of our French sites is exciting. This project supports the growing demand for sustainable packaging solutions and allows DS Smith to continue delighting our customers.\u201d<\/p>\n\n\n\n
The Beam 3 has received praise for its innovation and enhancements, including increased productivity, high-quality output, and workflow improvements. This will enable DS Smith to meet its customers’ fast turnaround and supply chain challenges, as well as to offer superior packaging solutions to its core customer segments.<\/p>\n\n\n\n
\u201cIt\u2019s been a huge privilege to work closely with the professional team at DS Smith to reach this important milestone\u201d said Moti Vaknin, Highcon\u2019s Key Account Manager.<\/p>\n\n\n\n
Highcon collaborated with BHS Corrugated to make this investment possible at DS Smith.<\/p>\n\n\n\n
\u201cIt\u2019s hugely exciting to exit a successful drupa with such an important announcement\u201d said Shlomo Nimrodi, Highcon\u2019s CEO. \u201cAdding DS Smith to Highcon\u2019s list of industry-leading customers is a huge feather in our cap and gives enormous impetus to the Highcon team. I have no doubt that this will act as a helpful tailwind as we follow up on the show.\u201d<\/p>\n\n\n\n