Some 1,150 representatives from the corrugated board industry and its suppliers heard about the latest innovations and process optimisation at the FEFCO Technical Seminar in Lyon on October 25-27, where ideas, policies and new technologies in the sector were debated.
Sustainability improvements, optimised energy consumption, production of lighter and stronger board systems and other smart technologies were showcased at Lyon\u2019s Centre de Congr\u00e8s which this year had the headline, \u201cShaping our future through innovations.\u201d<\/p>\n\n\n\n
This event brought together dynamic representatives of the corrugated sector, suppliers, customers, and industry visionaries to debate how intelligence and digitalisation can transform manufacturing processes, enhance supply chain management, and drive overall efficiency. The conference included specific sessions on energy efficiency and energy reduction, light paper grammages, artificial intelligence (AI), digital printing, logistics flows, bio-based coatings, cybersecurity, and EU legislation. For more interactivity, the programme was built around four panel discussions with leaders and experts from the industry and the sector.
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On the exhibition floor, 165 stands and 110 exhibitors from 41 countries showed off their products and services. The 2023 event set an attendance record and all numbers are up from the previous FEFCO events in Copenhagen (2021) and Geneva (2019).<\/p>\n\n\n\n
The FEFCO Technical Seminar kicked off after a key European Parliament Environment Committee vote on the EU\u2019s proposed Packaging and Packaging Waste Regulation (PPWR), which aims to reduce packaging waste across the entire economy.<\/p>\n","protected":false},"excerpt":{"rendered":"
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